Construct · 1 fields · 1 citations

chemical mechanical polishing: a standalone construct

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Manufacturing engineering

planarization of wafers by combined chemical attack and mechanical abrasion from a slurry under a rotating pad.

In manufacturing engineering, chemical mechanical polishing refers to planarization of wafers by combined chemical attack and mechanical abrasion from a slurry under a rotating pad. This meaning comes from Luo (2001) in IEEE Transactions on Semiconductor Manufacturing.[1]

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Nearby constructs

abrasion3 fields · 3 citationsjingle · one word, three constructs attack4 fields · 10 citationsjingle · one word, four constructs

References

Luo, J., & Dornfeld, D. A. (2001). Material removal mechanism in chemical mechanical polishing: theory and modeling. IEEE Transactions on Semiconductor Manufacturing, 14(2), 112-133. https://doi.org/10.1109/66.920723

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