Construct · 1 fields · 1 citations

solder joint fatigue: a standalone construct

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Electronic packaging

cracking of solder joints under repeated thermal expansion mismatch, predicted from cyclic shear strain.

In electronic packaging, solder joint fatigue refers to cracking of solder joints under repeated thermal expansion mismatch, predicted from cyclic shear strain. This meaning comes from Engelmaier (1983) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology.[1]

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Nearby constructs

expansion4 fields · 4 citationsjingle · one word, four expansions fatigue4 fields · 4 citationsjingle · one word, four different declines joint2 fields · 2 citationsjingle · one word, two constructs

References

Engelmaier, W. (1983). Fatigue Life of Leadless Chip Carrier Solder Joints During Power Cycling. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 6(3), 232-237. https://doi.org/10.1109/tchmt.1983.1136183

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