Construct · 1 fields · 1 citations

through-silicon via: a standalone construct

One name. One construct. A landmark on the map.

● anchor · a standalone construct Nearest construct by meaning·not indexed

A single standalone construct; nearby constructs are located against it in the Collider. Tap a field for its definition, unit, and measures.

Electronic packaging

a vertical electrical connection passing completely through a silicon die, enabling stacked 3D integration.

In electronic packaging, through-silicon via refers to a vertical electrical connection passing completely through a silicon die, enabling stacked 3D integration. This meaning comes from Motoyoshi (2009) in Proceedings of the IEEE.[1]

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Nearby constructs

3D integrated circuit1 fields · 1 citationsanchor · a standalone construct integration5 fields · 7 citationsjingle · one word, five constructs

References

Motoyoshi, M. (2009). Through-Silicon Via (TSV). Proceedings of the IEEE, 97(1), 43-48. https://doi.org/10.1109/jproc.2008.2007462

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