Construct · 1 fields · 1 citations

3D integrated circuit: a standalone construct

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Electronic packaging

stacking multiple active device layers vertically to shorten interconnects and combine different technologies.

In electronic packaging, 3D integrated circuit refers to stacking multiple active device layers vertically to shorten interconnects and combine different technologies. This meaning comes from Banerjee (2001) in Proceedings of the IEEE.[1]

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Nearby constructs

circuit1 fields · 1 citationsanchor · a standalone construct stacking3 fields · 3 citationsjingle · one word, three constructs through-silicon via1 fields · 1 citationsanchor · a standalone construct

References

Banerjee, K., Souri, S. J., Kapur, P., & Saraswat, K. C. (2001). 3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration. Proceedings of the IEEE, 89(5), 602-633. https://doi.org/10.1109/5.929647

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