Construct · 1 fields · 1 citations
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In electronics assembly, reflow is the soldering process in which solder paste is first printed onto the board and components are placed into it, and the whole assembly is then heated through a controlled temperature profile so the solder melts, or reflows, and on cooling solidifies into all the joints at once. Lee's Reflow soldering processes and troubleshooting treats the preheat, soak, peak, and cooling stages of that profile and the defects that a mis-set profile produces. The referent is the dominant joining process of surface-mount manufacturing, controlled by its time-and-temperature profile and the alloy's melting range.[1]
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