Construct · 1 fields · 1 citations

wire bond lift-off: a standalone construct

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Electronic packaging

detachment of bond wires from power chips caused by thermomechanical stress during power cycling, a main wear-out failure of modules.

In electronic packaging, wire bond lift-off refers to detachment of bond wires from power chips caused by thermomechanical stress during power cycling, a main wear-out failure of modules. This meaning comes from Ciappa (2002) in Microelectronics Reliability.[1]

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Nearby constructs

bond2 fields · 2 citationsjingle · one word, two constructs failure4 fields · 6 citationsjingle · one word, four constructs power6 fields · 13 citationsjingle · one name, six constructs

References

Ciappa, M. (2002). Selected failure mechanisms of modern power modules. Microelectronics Reliability, 42(4-5), 653-667. https://doi.org/10.1016/s0026-2714(02)00042-2

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