Where does void collide?

In electronics assembly, a void is a pocket of entrapped gas or flux volatiles left inside a solidified solder joint, common under area-array parts such as BGAs, that removes load-bearing and heat-conducting metal from the joint and so weakens it and raises its thermal resistance. Lee's Reflow soldering processes and troubleshooting ties voiding to flux outgassing, reflow profile, and pad and stencil design, and sets inspection limits on it. The referent is porosity within a joint, quantified as the percentage of the joint area or volume occupied by cavities on an X-ray image, and it is unrelated to a programming type or a nullified contract.[1]

Unit

The percentage of a solder joint's area or volume occupied by cavities

Recovery means

Not applicable

Measured by

Measured as percent void area or volume by X-ray and cross-section, against assembly acceptance limits

In contract law, void describes an agreement or act that has no legal force at all from the outset, as if it had never been made, and is therefore distinguished from a voidable one, which is valid until the party entitled to do so elects to set it aside. Black's Black's law dictionary draws exactly this line between void and voidable. The referent is a status of legal effect assigned to a transaction, not a physical or computational quantity, and it collides with the soldering and programming meanings only through the word.[3][2]

Unit

Not applicable (a legal status, not a measured quantity)

Recovery means

Not applicable

Measured by

Not measured; it is a legal characterisation of whether an agreement has any binding effect